MIL-PRF-49052G
7.
Rise time (see 3.12.6) shall not be greater than 7 seconds.
Overshoot shall be less than 40 percent of steady state output
brightness.
shock from +45°C to +23°C within 3 minutes or
c.
Temperature shock:
less.
reduce temperature to -51°C, hold for 1
d.
Low operating temperature:
hour.
1.
Input current shall not be greater than 19 mA.
Gain at 2 x 10-6 fc shall not be less than 7,500 and shall not
2.
be greater than 30,000.
Gain at 2 x 10-4 fc shall not be less than 1,500 and shall not
3.
be greater than 7,500.
4.
Operational stability and rise time testing.
Perform same tests
as 3.6.5 b.4 through b.7 listed above.
maintain temperature at -510C for 2 hours.
e.
Low Temperature storage:
shock from -51°C to +23°C within 3 minutes.
f.
Temperature shock:
g.
After exposure of the assembly(s) to the profiles listed above,
perform the following room temperature tests:
Gain at 2 x 10-6 fc shall not be less than 7,500 and shall not
1.
be greater than 15,000.
Gain at 2 x 10-4 fc shall not be less than 1,500 and shall not
2.
be greater than 4,500.
3.
Operational stability and rise time testing. Perform same tests
as 3.6.5 b.4 through b.7 listed above.
3.6.6 Equivalent background input (EBI). The equivalent background input at
room temperature (see 3.12.7) shall not exceed 2.5 x 10-11 lumens per square
centimeter when tested at 23oC.
3.6.7 Luminance gain. The assembly shall have a room temperature luminance
gain and high light level saturation characteristics as specified in Table II.
The input current at room temperature shall not exceed 16 mA at the light level
specified.
6
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