MIL-PRF-49166/2A(CR)
counterweight and associated hardware removed. Operation shall be at 30 Hz using the Scan-
Interlace, PL-1403/UA.
3.5.1 Scan angle and frequency.
3.5.1.1 Variable scan frequency. Not applicable.
3.5.1.2 Specific scan frequency (30 Hz). Scan frequency of the MX-9872(V)2/UA with
the Scan-Interlace, PL-1403/UA shall be adjusted to 30.0, ±0.5 Hz. Scan frequency drift shall
not be greater than ±3 Hz from the frequency at ambient setting when exposed to high and low
temperature environmental conditions (See MIL-PRF-49166).
3.5.1.3 Synchronous scan frequency. Not applicable.
3.5.1.4 Scan angle. The scan angle shall be adjusted to 6.1, ±0.3 degrees.
3.5.2 Interlace. The MX-9872(V)2/UA shall operate in the 2:1 interlace mode. The
interlace switching time shown in MIL-PRF-49166, Figure 1, shall not be greater than 4.0
milliseconds (ms).
3.5.3 Scan direction. The MX-9872(V)2/UA shall show the waveform shapes and phase
relationships in Figure 1 while operating in the 2:1 side or the 2:1 rear interlace mode.
3.5.4 Power consumption. Power required to operate the MX-9872(V)2/UA shall not
exceed 2.2 watts.
3.5.5 Scan efficiency. The MX-9872(V)2/UA scan efficiency shall be a minimum of 75
percent.
3.5.6 Scan jitter in azimuth. Jitter time shall be 62.0 microseconds maximum.
3.6 Environmental conditions. See MIL-PRF-49166 except as follows:
3.6.1 Vibration. The MX-9872(V)2/UA shall not be damaged by vibration over a
frequency spectrum at the specified g levels and amplitudes shown in Figure 2 for the X axis and
as shown in Figure 3 of MIL-PRF-49166 for the Y and Z axes. During specified vibration, the
average interlace waveform amplitude shown in MIL-PRF-49166, Figure 1 shall not deviate
from the amplitude without vibration by more than ±50 percent.
3.7 Workmanship. All electronic parts, components, assemblies or sub-assemblies shall be
free of smudges, excess solder, metal chips or the existence of any foreign material on any
surface. Bearing assemblies shall be free from rust, dirt or tool marks. Wires and integrated
circuitry shall be protected from contact with rough or irregular surfaces and be shielded from
shorting. MIL-HDBK-454 may be used as guidance.
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