MIL-PRF-49169B(CR)
3. REQUIREMENTS
3.1. Description. The Light-Emitting Diode Array, herein referred to as the LED module,
converts electrical signals into visible light within an infrared system.
3.2 Dimensions. The dimensions and outline characteristics of the Light-Emitting Diode shall be
in accordance with the following drawings to ensure proper interface and compatibility with the
family of diode arrays:
TYPE I
SM-D-806557
TYPE II
5002478
TYPE III
5002475
3.2.1. Weight. Weight of the LED module shall not be greater than 0.35 pound.
3.3. First article. When specified in the contract (see 6.2) the contractor shall furnish first article
units for inspection (see 4.2).
3.4. Parts, materials, and processes. The contractor shall select the parts, materials and
processes, but these materials shall be capable of meeting all of the operational and environmental
performance requirements specified herein.
3.5 LED array. Each LED array shall be operated (burned-in) for 150 hours prior to assembly in
the LED module. Burn-in shall be performed by biasing the array so that minimum bias current is
not less than 1.33 milliamperes. Ambient temperature need not be controlled during burn-in.
3.6. Performance characteristics. Unless otherwise specified herein, the LED module shall meet
specified performance requirements at an ambient temperature of +23° C ±2° C and all bias
tolerances shall be ±0.1 Vdc.
3.6.1. Radiated power output. The average element radiant power, defined as the sum of each
element's radiant power divided by the number of elements, shall be as tabulated below:
AVERAGE RADIANT POWER x 10-6
BIAS
(WATTS)
(VDC)
AT -54° C
AT +23° C
AT +71° C
≥ 2.0
≥ 2.0
≥ 1.1
2.5
≥ 7.5
= 7.5, ± 0.4
≥ 4.3
4.0
≥ 21.0
≥ 21.0
≥ 12.0
8.4
3.6.2. Input power. The total power applied to the LED module with 4.0 Vdc applied (see 4.5.2)
shall not be greater than 3.4 watts for Type I, 2.3 watts for Type II, or 1.7 watts for Type III.
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