MIL-PRF-49169B(CR)
3.6.3. Array configuration. The LED module shall consist of 180, 120 or 90 elements arranged
in a configuration with pin-to-element connections as specified on the applicable drawing (see
3.11.2).
3.6.4. LED module tracking. The radiated power output of each element shall track the average
element radiated power in accordance with the requirements as follows:
% TRACKING
AT -54° C
AT 23° C
AT 71° C
BIAS (VDC)
± 15
± 10
± 15
2.5
± 10
±5
± 10
4.0
± 15
± 10
± 15
8.4
3.6.5. LED wavelength. The wavelength of light from each element shall be 660 ±10 nanometers
with the LED module biased at 4.0 Vdc.
3.6.6. Emitting area. The emitting area dimensions shall be as specified on the applicable
drawings. There shall be no more than 4 shape defects (see 3.11.3) in an LED array. The
channels of the LED array as defined below shall be defect-free of shape defects.
Type I -
channels 31 through 150
Type II
channels 51 through 130
Type III - channels 71 through 110 and 141, 142, 143
3.7. Environmental conditions.
3.7.1. Temperature shock. The LED module shall not be damaged (see 3.11.4) by sudden
changes in temperature between -54° C and +95° C.
3.7.2. High temperature. The LED module shall not be damaged (see 3.11.4) under storage to
+95° C, or continuous operation to +71° C, and shall operate for 30 minutes at +95° C.
3.7.3. Low temperature. The LED module shall not be damaged (see 3.11.4) by operation to
-54° C or storage to -62° C.
3.7.4. Shock. The LED module shall not be damaged (see 3.11.4) by high intensity shocks of
100 g's peak amplitude with 11 milliseconds duration and by bench handling tests.
3.7.5. Vibration. The LED module shall not be damaged (see 3.11.4) by vibration over the
frequency spectrum at the specified g levels and amplitudes shown in Figure 1.
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