MIL-PRF-49316A(CR)
3.11.1 Soldering. Soldering shall be in accordance with ANSI/IPC-S-815A.
3.12 Technical interpretations. The following technical interpretations are, when
referenced in sections 3, 4, or 5 mandatory for this specification.
3.12.1 Damage. Damage is defined as any breakage, loosening, shifting, or failure of any
finish, hardware, connection, component, or condensation on any internal surface, or failure to
operate in accordance with the requirements of this specification.
3.12.2 Room temperature. Room temperature is defined as + 23°C, ± 10°C.
3.12.3 Infant mortality. Those failures which occur due to poor workmanship or weak
components.
3.12.4 Environmental Stress Screening (ESS). An ESS failure is any shortcoming,
imperfection or operational non-conformance, including a one-time non-repeatable anomaly,
either sudden or gradual in nature, which causes the unit under test to deviate from specified
limits. ESS failures, include poor workmanship (i.e. solder balls or cracks), defective
manufacturing processes (i.e. wave soldering devices which cannot handle the heat) and
defective components. Non-ESS failures are those failures directly attributed to improper
installation in the test facility, failures of test monitoring equipment, failures due to operator
errors, failures occurring during repair, and failures attributed to test equipment generating
overstress conditions.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are
classified as follows:
a. First article inspection (see 4.2).
b. Conformance inspection (see 4.3).
4.2 First article inspection.
4.2.1 Visual inspection. Each first article shall be inspected in accordance with Table VIII,
either in process or when assembled, as required. Presence of one or more defects shall be cause
for rejection of that assembly and may be cause for rejection.
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